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US and China Sign $22 Billion Semiconductor Trade Pact to Reopen High-Tech Markets
US and China sealed a $22 billion chip trade pact allowing broader semiconductor exports and joint R&D, boosting global supply-chain sentiment.
The United States and China finalized a $22 billion bilateral agreement permitting expanded semiconductor and chip-equipment exports under new licensing standards. The pact aims to restore stable supply chains after years of restrictions and trade disputes. It includes provisions for joint R&D centers and IP-protection frameworks. Analysts expect the move to benefit American firms such as Nvidia, Lam Research, and Applied Materials. Beijing’s Ministry of Commerce said the deal strengthens economic trust ahead of next year’s APEC summit.
Semiconductor stocks rose 2 percent on Wall Street following the announcement.